| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a production process of fluid injection devices in which a lot of the fluid injection devices are finished in a wafer-shape. SOLUTION: A production process of fluid injection devices consists of processes of forming of a heating driving part 110, a membrane 120, a nozzle part 130 separately and bonding these parts one by one. The nozzle part is formed through a first stage in which a nozzle plate 132 is formed on a silicon wafer through a spinning process, a second stage in which an injection fluid barrier layer 131 is formed on the upper surface of the nozzle plate by the spinning process, a third stage in which an injection fluid chamber is formed in the injection fluid barrier layer, a forth stage in which a nozzle is formed on a nozzle plate, and a fifth stage in which the silicon wafer is separated from the nozzle plate. The fifth stage is applied after the nozzle part and the membrane are bonded. The third stage is performed by a wet etching process, and the fourth stage is performed by laser beam work or reactive ion etching.</p> |
