| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having high adhesion to a lead frame, especially, a copper-based lead frame and excellent reflow properties by mixing a biphenyl epoxy resin with a phenolaralkyl resin, a triphenylphosphine/benzoquinone adduct, an inorganic filler, and a specified amount of an indene resin as an essential component. SOLUTION: The biphenyl epoxy resin is one represented by formula I and the phenolaralkyl resin is a curing agent and is one represented by formula II. It is desirable that the inorganic filler is used in an amount of 70-85 vol.% based on the entire composition, and at least 50% of the filler is a spherical one. The amount of the indene resin used is 2.5-20 pts.wt. per 100 pts.wt. epoxy resin. This is a copolymer resin of an indene such as indene or an alkylindene with a styrene and a phenol and is obtained by cationically polymerizing these monomers in the presence of a catalyst being a Lewis acid, Bronsted acid, or a solid acid.
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