| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin molded product having toughness, high heat resistance, a low coefficient of linear thermal expansion and low water absorptivity and having good processability. SOLUTION: This product has a flexural modulus of at least 5 GPa, a heat distortion temperature of at least 400 deg.C, a coefficient of linear thermal expansion of 20-50 ppm/ deg.C, and a water absorptivity of 0.001-0.1%. It is desirable that the product has an oxygen plasma resistance of 8μm/cm2. or below in terms of an etching rate and that the polyimide resin is prepared by imidizing a polymer prepared from an aromatic tetracarboxylic acid component comprising a mixture of 3,3'-4,4'-biphenyltetracarboxylic acid, its ester, or its acid dianhydride with 2,3,3',4'-biphenyltetracarboxylic acid, its ester, or its acid anhydride and an aromatic diamine component comprising p-phenylenediamine.
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