| 摘要 |
PROBLEM TO BE SOLVED: To obtain a silicone composition suitable for the use as an encapsulant or the like for a chip-scale package. SOLUTION: This silicone composition comprises (A) 100 pts.wt. polydiorganosiloxane having two or more alkenyl groups bonded to silicon per molecule in average, (B) 75-150 pts.wt. organopolysiloxane resin having 2,000-5,000 Mn, comprising an R32R4SiO1/2 unit and an SiO4/2 unit [each R3 is independently selected from a monovalent hydrocarbon group and a monovalent halogenated hydrocarbon group not containing an aliphatic unsaturated group; R4 is selected from R3 and an alkenyl group; the molar ratio of the R32R4SiO1/2 unit to the SiO4/2 unit is (0.6:1)-(1.1:1)] and containing 2.5-7.5 mol% alkenyl group in average in the resin, (C) an organohydrogenpolysiloxane capable of providing 1-3 hydrogens bonded to the silicon per alkenyl group in the components A and B, (D) an adhesion promoter, and (E) a hydrosilylation catalyst. |
