发明名称 |
Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame |
摘要 |
A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection ports are formed in the leads with a second pitch. The sealing plastic seals the lines connecting the electrode pads and the leads, but the projections are exposed from the sealing plastic.
|
申请公布号 |
US6060768(A) |
申请公布日期 |
2000.05.09 |
申请号 |
US19970935892 |
申请日期 |
1997.09.23 |
申请人 |
FUJITSU LIMITED |
发明人 |
HAYASHIDA, KATSUHIRO;SATO, MITSUTAKA;UNO, TADASHI;FUJISAWA, TETSUYA;WAKI, MASAKI |
分类号 |
H01L21/60;H01L21/56;H01L23/12;H01L23/28;H01L23/31;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L29/46 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|