发明名称 |
PRINTED WIRING BOARD |
摘要 |
A printed wiring board which has a conductor circuit (12) on an insulating substrate (10) and a surface insulating layer (14) formed on the surface of the substrate (10) including the surface of the conductor circuit (12). Part of the conductor circuit (12) has an exposed conductor section (120) having an exposed surface, and a surface insulating layer (140) around the conductor section (120) forms a recessed section at the same level of the surface of the conductor section (120) or lower than the surface. It is preferable to form a solder resist layer which is formed as the surface insulating layer in block or white color. <IMAGE> |
申请公布号 |
EP0997935(A1) |
申请公布日期 |
2000.05.03 |
申请号 |
EP19980905813 |
申请日期 |
1998.03.09 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TSUKADA, KIYOTAKA;TAKADA, MASARU;KONDO, MITSUHIRO;KOBAYASHI, HIROYUKI |
分类号 |
H05K3/28;H01L21/60;H01L23/12;H01L23/498;H05K1/18;H05K3/00;H05K3/34;H05K3/38 |
主分类号 |
H05K3/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|