| 发明名称 |
Chemical mechanical polish platen and method of use |
| 摘要 |
The present disclosure relates to a chemical mechanical polishing apparatus used for polishing wafers. The apparatus includes a polish platen and structure for separating the platen into at least first and second zones such that polishing fluid used in the first zone is prevented from entering the second zone.
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| 申请公布号 |
US6056631(A) |
申请公布日期 |
2000.05.02 |
| 申请号 |
US19970947600 |
申请日期 |
1997.10.09 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BROWN, THOMAS M.;BURKE, PETER AUSTIN |
| 分类号 |
B24B27/00;B24B37/04;(IPC1-7):B24B7/22 |
主分类号 |
B24B27/00 |
| 代理机构 |
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