| 摘要 |
<p>PURPOSE: A semiconductor device is provided to selectively connect between pads and ports of a main circuit part. CONSTITUTION: The semiconductor device comprises a plurality of pads(PAD #0¯ PAD #i) formed in a chip, a main circuit part(100) having a plurality of I/O ports, a plurality of first interconnections(A0¯Ai), a plurality of second interconnections(B0¯Bi), a plurality of third interconnections(C0¯Ci), and a plurality of contact regions for selectively connecting the interconnections each other. One ends of the second interconnections(B0¯Bi) are connected to the pads, respectively. One ends of the third interconnections(C0¯Ci) are connected to the I/O ports, and the other ends of the third interconnections(Co¯Ci) are connected to the first interconnections, respectively.</p> |
