| 摘要 |
PURPOSE: A floor device of a solder ball bumping system for a BGA semiconductor package is provided to easily supply PCB to a material setting part of a table. CONSTITUTION: A floor device(40) receives a PCB from a pusher part of a solder ball bumping system to guide the PCB to a table. A guide rail(40A) is installed on a holder(40A) in left and right sides for the PCB to be slidably moved. A motor is installed on the guide rail(40A). A belt(41) is connected to the motor(42). A stopper(44) is installed on a cylinder(44A) to be upwardly and downwardly moved on a central part of the holder(40A). A cylinder(45A) is installed on a block, upwardly and downwardly moved on other end of the holder(40A), and permits the PCB to be seated therein. A sensor(43) is formed on an upper part of a side end of the holder(40A) to confirm whether a material is supplied and a right position of the PCB. A robot A(R1) is installed on a base of other side of the holder(40A), refracted in multi-steps, and grips the PCB.
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