发明名称 |
Wafer cleaning and vapor drying system and method |
摘要 |
The present apparatus is a method and system for treating and drying the surface of an object. According to the described method, with a wet object positioned in a vessel, a drying vapor is introduced into the vessel. The drying vapor condenses on the surface of the object and reduces the surface tension of the residual process fluid, causing the residual process fluid to flow off of the surface. In one embodiment, wet processing of the object and a subsequent evacuation of process fluid is carried out in the vessel prior to introduction of the drying vapor. |
申请公布号 |
AU6271599(A) |
申请公布日期 |
2000.05.01 |
申请号 |
AU19990062715 |
申请日期 |
1999.09.28 |
申请人 |
SCP GLOBAL TECHNOLOGIES, A DIVISION OF PRECO, INC. |
发明人 |
ELSAWY TAMER;R. MARK HALL;JOSH BUTLER |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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