发明名称 |
Method for I/O device layout during integrated circuit design |
摘要 |
A method for laying out input/output (I/O) pairs, each including an I/O cell and a pad, on an integrated circuit die. Size information is obtained for each of a first I/O pair and a second I/O pair. A minimum pad spacing criterion is obtained which specifies a minimum distance between the pad in the first I/O pair and an element of the second I/O pair, and the first I/O pair and the second I/O pair are laid out so as to satisfy the minimum pad spacing criterion. Also provided is a method for laying out pads for input/output (I/O) cells on an integrated circuit die in which size information is obtained for each of a first I/O cell pad and a second I/O cell pad. A minimum pad spacing criterion is obtained, and the first I/O cell pad and the second I/O cell pad are laid out so as to satisfy the minimum pad spacing criterion.
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申请公布号 |
US6057169(A) |
申请公布日期 |
2000.05.02 |
申请号 |
US19980062254 |
申请日期 |
1998.04.17 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
SINGH, VIRINDER;LIANG, MIKE |
分类号 |
G06F17/50;H01L23/50;(IPC1-7):H01L21/66 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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