发明名称 Method for forming interlevel dielectric layer in semiconductor device using electron beams
摘要 A method for stabilizing an interlevel dielectric layer formed by a chemical vapor deposition (CVD) process, using electron beams. A CVD oxide layer is formed on a semiconductor substrate. The CVD oxide layer is radiated with electron beams at a temperature of between approximately room temperature and approximately 500 DEG C. for a predetermined time, using an electron beam radiator, to densify the layer.
申请公布号 US6057251(A) 申请公布日期 2000.05.02
申请号 US19980164938 申请日期 1998.10.01
申请人 SAMSUNG ELECTRONICS, CO., LTD. 发明人 GOO, JU-SEON;KIM, SEONG-HO;LEE, HAE-JEONG;HWANG, BYUNG-KEUN
分类号 H01L21/31;H01L21/3105;H01L21/312;H01L21/316;H01L21/768;(IPC1-7):H01L21/31 主分类号 H01L21/31
代理机构 代理人
主权项
地址
您可能感兴趣的专利