| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a wiring structure for preventing burnout between wiring and the increase in resistance, even if a wiring layer is formed at a position that is deviated from a connection hole. SOLUTION: A semiconductor device is provided with a first insulation layer 6, that is formed on a semiconductor substrate 1 and has a connection hole 7 reaching the surface of the semiconductor substrate 1, an embedded conductive layer 8 that is embedded into the connection hole 7, a wiring layer 12 that is formed on the interlayer insulation layer 6 and the embedded conductive layer 8, an insulator layer 16 that is formed on the surface of the wiring layer 12, and a second insulation layer that is formed on the insulator layer 16 and the first insulation layer.
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