| 摘要 |
PROBLEM TO BE SOLVED: To provide performance equal to that of a Sn-Pb alloy plated lead by constituting a plating layer formed on a lead base material with a bed layer of Sn and an outer layer of Sn-Ag alloy. SOLUTION: A lead for an electronic component has a plating layer 2 formed on an acid-cleaned wire 1 made of copper alloy having a specified outer diameter. The plating layer 2 is constituted with a bed layer 3 of Sn plating, having specified thickness, formed by an electrolytic process, and an outer layer 4 of Sn-Ag alloy plating on the bed layer 3, formed by an electrolytic process. The Sn-Ag alloy for constituting the outer layer 4 contains a very small amount of Ag and forms the outer layer 4 so as to have specified thickness. Adhesion, solder wettability, color changing resistance, and whisker producing resistance of the plating layer are enhanced, and as the lead for an electronic component capable of replacing the Sn-Ag alloy plating lead, excellent characteristics is developed and is effectively usable. Since the amount of Ag used is very small, there is no economical disadvantage.
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