| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which can be mounted automatically and efficiently conducts and radiates heat of an electronic component. SOLUTION: A heat sink 10 comprises a heat radiating plate 11, which is formed by press machining so that a rectangular metal plate of aluminum, copper, etc., is bent in the length direction and a phase varying member 12 which is stuck on the ceiling surface 11a of the heat radiation plate 11 and has alumina dispersed as a heat-conductive filler in paraffin. When the heat sink 10 and electronic component 41 are soldered to a printed wiring board 49 heated by a reflow soldering, the phase varying member 12 formed of paraffin is molten, and part of it moves down gravitationally as shown by the alternate long and two short dashed line and is solidified, abutting against the top surface 41a of the electronic component 41, thereby connecting the heat radiation plate 11 and electronic component 41 together. |
