发明名称 LAMINATED CHIP COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent the generation of splitting, cracks, etc., of an outer peripheral edge and a corner part by arranging inner electrodes in the surface of a ceramic layer, except the lead-out parts of lead-out electrodes, by keeping a specified distance from an outer peripheral edge of the ceramic layer, and forming a laminated chip element assembly of a laminated material which are constituted only of ceramic layers by a specified outer peripheral width. SOLUTION: A capacitor element assembly C is formed by alternately laminating inner electrodes 10, 11 and dielectric ceramic layers 12 a plurality number of times. The inner electrodes 10, 11 are formed by printing in the surface of the dielectric ceramic layer 12, together with leading-out electrodes 13, 14 to be led out to the end portions positioned in the mutually reverse directions. The inner electrodes 10, 11 are formed by printing in the surface of the ceramic layer 12, except leading-out parts of the leading-out electrodes 13, 14 and keeping a distance G of at least 50μm from the outer peripheral edge of the ceramic layer 12. The capacitor element assembly C is formed by using only the laminated member of the ceramic layers 12 with an outer peripheral width of at least 50μm.
申请公布号 JP2000124064(A) 申请公布日期 2000.04.28
申请号 JP19980299745 申请日期 1998.10.21
申请人 TDK CORP 发明人 TANIGAWA TOMOYUKI;ITO TAKAYOSHI;IKEDA ATSUSHI
分类号 H01G4/12;H01C7/10;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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