| 摘要 |
PROBLEM TO BE SOLVED: To reduce cost by increasing the number of modules which can be manufactured from a raw material film A, when many modules for IC cards having integrated circuit chips mounted on film pieces are manufactured in a longitudinal and lateral array state, at the same time as from the raw material film A. SOLUTION: At parts of both the lateral right and left end parts of the film piece 11 of a module 10, cut-out parts 15 for which the parts of both the right and left end parts of laterally adjacent film pieces 11 when the film pieces 11 are arranged laterally so as to enter into are provided, and then parts of both the right and left end parts of the respective film pieces 11 which are arrayed laterally along the length of the film pieces 11 are made to overlap with each other in the length direction. |
