发明名称 MULTILAYER CERAMIC CHIP CAPACITOR
摘要 PROBLEM TO BE SOLVED: To obtain a multilayer chip capacitor whose service life is long and reliability is superior by constituting the inner electrode material which is nickel or a nickel alloy and a dielectric material in a laminated state, baking the materials in a neutral or reducing atmosphere, and thermally treating the materials in a neutral or weak reducing atmosphere. SOLUTION: In a multilayer chip capacitor 1, inner electrodes 21, 25 and dielectric layers 3 are laminated alternately, and a pair of outer electrodes 51, 55 are connected with the respective inner electrodes 21, 25. In this case, the inner electrodes 21, 25 are formed of Ni or Ni alloy. After that, baking is performed. In order to have the dielectric layer 3 re-oxidized, thermal treatment is performed. In the baking, a neutral or reducing atmosphere, especially a moistened mixture gas of N2 and H2 or the like is used as the gas for the reducing atmosphere. It is preferable that a heat treatment be performed at 900-1,200 deg.C. As the gas for atmosphere, neutral or weak reducing atmosphere, especially moistened N2 gas or the like is used.
申请公布号 JP2000124058(A) 申请公布日期 2000.04.28
申请号 JP19990252052 申请日期 1999.09.06
申请人 TDK CORP 发明人 ABE MICHIRO;NOMURA TAKESHI;SUMITA NARIKAZU;NISHIYAMA TSUGUSUKE;NAKANO YUKIE;IKEDA MASAAKI
分类号 H01G4/12;C04B35/49;H01B3/12 主分类号 H01G4/12
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