发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for manufacturing a semiconductor device with a polysilicon layer of a hemisphere-shaped grain is provided to improve density of silicon crystal nuclei by forming twice the silicon crystal nuclei. CONSTITUTION: An amorphous silicon layer(12) is formed on a semiconductor substrate(10). The semiconductor substrate(10) formed with the amorphous silicon layer(12) is loaded on a chamber. A silicon source gas is injected into the chamber in order to seed a silicon crystal core on the amorphous silicon layer(12). The silicon source gas is injected again into the chamber in order to enlarge a size of the silicon crystal core. A polysilicon layer(24) having a hemisphere-shaped grain is formed by annealing the silicon substrate(10) formed with the amorphous silicon layer(12) and the silicon crystal core.
申请公布号 KR100255662(B1) 申请公布日期 2000.05.01
申请号 KR19970017192 申请日期 1997.05.03
申请人 SAMSUNG ELECTRONICS CO.,LTD. 发明人 HAN, CHAN HUI;KANG, YONG HO;YANG, CHANG JIB;PARK, YONG KYU
分类号 H01L27/108;H01L21/02;H01L21/31;H01L21/8242;(IPC1-7):H01L21/31 主分类号 H01L27/108
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