发明名称 DISMANTLING METHOD AND SYSTEM OF PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board dismantling method and system, where electronic parts mounted by clinching lead wires or by the use of eyelets are easily, surely dismounted from a printed circuit board, and various types of printed circuit boards can be dismantled through the same simple structure. SOLUTION: An electronic part 12 mounted on a solder surface 7b on a printed circuit board 7 is dismounted by melting solder 54, and then the solder surface 7b is cut off, whereby a joint between an electronic part 11 mounted on a part surface 7a and the solder surface 7b is removed off. Then, solder 54 on the part surface 7a on an opposite side to the solder surface 7b is melted, and the electronic part 11 mounted on the part surface 7a is stripped off. Lastly, the part surface 7a is cut off.
申请公布号 JP2000124597(A) 申请公布日期 2000.04.28
申请号 JP19980289380 申请日期 1998.10.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUKUSHIMA TETSUO;NAKAI SHOJI;FURUSAWA AKIO;SUETSUGU KENICHIRO
分类号 B09B5/00;H05K3/34;(IPC1-7):H05K3/34 主分类号 B09B5/00
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