| 摘要 |
What is described here is an electrical and mechanical contact consisting of a rigid background, a flat thin bond structure and a bond connection, as well as a method of electrically and mechanically connecting a flat thin bond structure with a rigid background by means of a bond head.In an approach to permit the production of bond contacts on a minimum of space with the smallest pitch spacings possible up to 50 mum it is proposed that the bond structure presents a hole and that the bond connection is substantially a bond element which extends from the background through the hole in the bond structure up to a zone located above the bond structure, and that the bond element, in the area located above said bond structure, extends laterally at least partially beyond said hole in said bond structure, thus ensuring the contact of the background with the underside of said bond structure.In an approach to enable the production in the most simple, time- and cost-saving manner, it is proposed that the bond head is bonded through a hole in the bond structure bond head, for most of its part, is bonded through a hole in the bond structure directly onto the background while the bond structure is pressed by the bond head against the background. |
