| 摘要 |
The invention concerns a method for mounting an electric or electronic installation comprising at least an electronic component (20) and at least a heat exchanger (1), said component (20) and said exchanger (1) being designed to be maintained in thermal contact by pressure after being mounted. The invention is characterised in that it consists in pre-positioning said exchanger (1) on said component (20) before integrating said component (20) and said exchanger (1) in said installation and applying pressure The exchanger bears, on one face (3) capable of being urged into electric and/or thermal contact with the component (20) and/or main supply bus, means (10, 11) for removable pre-positioning with respect to said component (20) and/or said bus. |
