| 摘要 |
A computer case shaped to provide cooling of the computer's electronic parts is described. The case is formed from metal or thin plastic which can be stamped or injection molded in the desired shape for cooling. The case has a plurality of sides and a bottom. In a first aspect, a plurality of ribs is formed on at least one of the sides, thereby increasing the surface area available for heat dissipation. The bottom may also be corrugated. In a second aspect, slots are provided in at least one of the sides, and the heat generating microprocessor is positioned adjacent to the slotted sides. In a third aspect, a plate is attached to the bottom by means of angled edges at the periphery of the plate so as to allow a gap between the attached plate and the case bottom for trapping a gas therebetween and providing insulation from heat at the case bottom. Optionally, openings are provided in the angled edges for additional convective cooling of the case bottom.
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