发明名称 SYRUP COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a syrup composition capable of being cured at normal and lower temperatures, excellent in quick curing, cold cure and weatherability and useful as a marking material for roads having little sensitivity to temperature, a floor and wall surface primers or a binding material for resin mortar, or the like. SOLUTION: This syrup composition contains a liquid resin consisting of a urethane (meth)acrylate (I) comprising (A) a multivalent isocyanate component, (B) a polyol component comprising a polyester polyol and/or a polyoxyalkylene glycol and (C) a hydroxyl group-containing (meth)acrylate component and a copolymerizable vinyl monomer (II) in a ratio of (I)/(II)=15/85-70/30, a curing agent and a hardening accelerator.
申请公布号 JP2000119353(A) 申请公布日期 2000.04.25
申请号 JP19980298676 申请日期 1998.10.20
申请人 MITSUBISHI RAYON CO LTD 发明人 IWASAKI KAZUHIKO;AOKI TOSHIICHI
分类号 C08L75/16;C08F290/06;C09D175/04;(IPC1-7):C08F290/06 主分类号 C08L75/16
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