发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A semiconductor device and fabricating method thereof is provided to fabricate a highly dense and highly integrated device by preventing damage of a gate oxide. CONSTITUTION: A substrate(101) on which a predetermined device is formed is provided. An insulating layer(109) is formed to cover the device. A contact hole(111) is opened in the insulating layer(109) to expose surface of the substrate(101). A contact block(113) is formed in the contact hole for electrical contact with the substrate. A first metal layer(110) having high adhesiveness to the insulating layer is formed on the insulating layer. A second metal layer(112) is formed on the surface of the substrate(101) by plasma CVD method.
申请公布号 KR20000023508(A) 申请公布日期 2000.04.25
申请号 KR19990041663 申请日期 1999.09.29
申请人 NIPPON DENKI KABUSHIKI KAISHA 发明人 TAGUWA TETSUYA
分类号 H01L21/768;H01L21/28;H01L21/3205;(IPC1-7):H01L21/320 主分类号 H01L21/768
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