发明名称 |
Package for enclosing microoptical and/or microelectronic devices so as to minimize the leakage of microwave electromagnetic radiation |
摘要 |
The invention relates to a package for microoptical and/or microelectronic devices. The package is to be designed in such a way that package resonances initiated by standing waves produced in the package are completely avoided or very highly attenuated. This is achieved by making the package, in whole or in part, of a microwave-absorbing, nonoutgassing material. A suitable material is silicon or graphite, for example.
|
申请公布号 |
US6054766(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19980036451 |
申请日期 |
1998.03.06 |
申请人 |
ALCATEL |
发明人 |
KAISER, DETLEV;HIRLER, HANS-PETER |
分类号 |
H05K9/00;H01L23/02;H01L23/04;H01L23/06;H01L23/66;H01L31/02;(IPC1-7):H01L23/34 |
主分类号 |
H05K9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|