| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve precision of connection positions of a plurality of wires and reduce irregular ON-resistance, by forming an alignment mark showing the connection position of each wire on an electrode pad on a semiconductor pellet. SOLUTION: In this device, alignment marks 13a-13c showing connection positions of the respective one ends of three wires 11a-11c to be connected with an emitter electrode 7 are formed around the electrode 7 through which a main current flows. The wires 11a-11c are connected with positions designated by the alignment mark 13c in three regions divided by the alignment marks 13a, 13b, so that currents flowing into the wires 11a-11c are made uniform. As a result, connection resistance between the electrode 7 and the wires 11a-11c is made as small as possible and irregularity is reduced. Thereby ON-resistance connected by a plurality of wires is reduced and further irregularity of the resistance can be restrained.</p> |
