发明名称 COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME
摘要 <p>A copper alloy material for electrical and electronic components and a method of preparing the same are disclosed. In particular, a copper alloy material with excellent mechanical strength characteristics, high electrical conductivity, and high thermal stability as a material for information transmission and electrical contact of connectors or the like for home appliances and automobiles, including semiconductor lead frames and a method of preparing the same are disclosed.</p>
申请公布号 PH12013000337(A1) 申请公布日期 2015.05.18
申请号 PH12013000337 申请日期 2013.11.11
申请人 POONGSAN CORPORATION 发明人 PARK, CHEOL MIN;HWANG, IN YOUB
分类号 C22C9/06;C22C9/10;C22F1/08;H01B1/02 主分类号 C22C9/06
代理机构 代理人
主权项
地址