发明名称 |
COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME |
摘要 |
<p>A copper alloy material for electrical and electronic components and a method of preparing the same are disclosed. In particular, a copper alloy material with excellent mechanical strength characteristics, high electrical conductivity, and high thermal stability as a material for information transmission and electrical contact of connectors or the like for home appliances and automobiles, including semiconductor lead frames and a method of preparing the same are disclosed.</p> |
申请公布号 |
PH12013000337(A1) |
申请公布日期 |
2015.05.18 |
申请号 |
PH12013000337 |
申请日期 |
2013.11.11 |
申请人 |
POONGSAN CORPORATION |
发明人 |
PARK, CHEOL MIN;HWANG, IN YOUB |
分类号 |
C22C9/06;C22C9/10;C22F1/08;H01B1/02 |
主分类号 |
C22C9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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