| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a polyimide board having a high bonding force by setting the concentration of a Cu compound water soln. to a specified value or less and irradiating a specified number of pulses of an UV ray of a specified energy density or less at a wavelength in a specified range from a synthetic quartz window material. SOLUTION: A Cu compd. water soln. is dripped on a polyimide board 11, a flat plate-like quartz window member 12 is mounted thereon, the liq. drops expand due to the capillary effect to form a thin liq. layer area 13 of the Cu compd. water soln. set to a concn. of 1% or less, five or less pulses of an UV light of 170-200 nm in wavelength are irradiated at an energy density of 40 mJ/cm2 through the window member 12 to deposit Cu atoms in the Cu compd. soln. by the substitution in the UV light-irradiated part of the polyimide board 11 surface, and the Cu-deposited board 11 is plated with Cu. Thus, the polyimide board 11 can be manufactured with a high bonding force.
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