发明名称 MANUFACTURE OF LEAD FRAME WITH RADIATING PLATE
摘要 PROBLEM TO BE SOLVED: To realize a means by which the sticking of insulating tape on a lead frame, the separation of radiating plates one by one from a radiating plate sheet and the sticking of the radiating plate on the lead frame can be performed by sequential manufacturing operations. SOLUTION: A guide hole is formed in a lead frame 1, in an insulating film and in a radiating plate sheet 7, respectively. First, the lead frame 1 and the insulating film are positioned using the holes for positioning formed in them, respectively. Then the insulating film is cut out in a desired shape and the cut film is stuck on the lead frame 1. After that, the lead frame 1 on which the insulating film is stuck and the radiating plate sheet 7 are positioned using the positioning holes made in them, respectively. A radiating plate is punched from the radiating plate sheet 7 with a punching die 10. The punched radiating plate is pressed against the insulating film on the lead frame and is stuck on it.
申请公布号 JP2000114446(A) 申请公布日期 2000.04.21
申请号 JP19980279815 申请日期 1998.10.01
申请人 SUMITOMO METAL MINING CO LTD 发明人 MUTO AKIO;WATANABE AKIRA
分类号 B26F1/00;B21D28/00;B21D43/02;H01L23/50;(IPC1-7):H01L23/50 主分类号 B26F1/00
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