| 摘要 |
PROBLEM TO BE SOLVED: To stick proper quantities of melted solder corresponding to the lead shapes of different types of electronic components on one printed board and improve the quality and reliability of soldering. SOLUTION: Guide plates 11A-11C are provided on support shafts 12A-12C so as not to overlap each other in the axial directions of the support shafts. If leads which have different shapes are provided in the width direction of a printed board 84, the guide plates 11A-11C are turned to change the positions of peel-back points PBP in the width direction of a printed board 84 respectively. That is, even if a plurality of types of electronic components are mounted on one printed board 84 not only in the transfer direction but also in the width direction, proper quantities of melted solder corresponding to the lead shapes of the electronic components can be stuck.
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