MANUFACTURE OF SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To simply and highly accurately position a semiconductor element of large diameter relative to that of small diameter, when these semiconductor elements are to be bonded through bumps. SOLUTION: A wafer 10 with demarcated semiconductor elements 3 of large diameter, and semiconductor elements 4 of small diameter divided into chip forms are prepared. Each of the elements 4 is overlapped upon the corresponding element 3 on the wafer 10, and they are bonded together. The elements 3 are thereafter cut from the wafer 10 in the form of chips.