| 摘要 |
PROBLEM TO BE SOLVED: To perform mounting treatment to a plurality of substrates at a time, and at the same time to flexibly cope with the fluctuation of the number and kinds of substrates to be treated. SOLUTION: In a surface-mounting device, a working position 4 for mounting a part onto a printed-circuit board is provided on the carrier path of the printed circuit board due to a conveyer 2, and sensors 5a-5d for detecting the substrate are arranged at the working position 4. A substrate recognition camera 8 is mounted at a head unit 7, where the camera 8 picks up the image of a mark for recognizing the substrate. Furthermore, an operation means 13 for examining the number and kinds of the substrates being set to the working position 4 based on a detection result due to the sensors 5a-5d and a pick-up image by the substrate recognition camera 8 and determining the order of the sucking placement of the part according to the mounting information of each substrate being stored in a storage part 14, and a main control means 11 for controlling the operation of the head unit 7 so that the part can be sucked and placed according to the determination order are provided. |
