| 摘要 |
PROBLEM TO BE SOLVED: To prevent failure of soldering by providing a circular connecting patter to a place corresponding to a terminal, and by making only a connecting pattern which is for connecting to the terminal corresponding to the outermost peripheral part of a package into a rectangular pattern which partially protrudes outward from the package. SOLUTION: A pattern 5 of a printed wiring board 4 on the outer periphery of a BGA-IC terminal is made into a rectangular shape so as to protrude partially from a package of the BGA-IC. In short, the pattern 5 is made into a rectangular shape, and it has a shape protruding outward a little from a dimension 6 of the package. A circular pattern 3 has the same form and size as of a conventional technique. As a result, whether solder is applied onto the pattern 5 or not can be observed visually even in a condition that it is mounted on the printed wiring board, so that whether or not there is failure of soldering is judged by visual observation.
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