| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photosensitive resin compsn. with which a thick film fine pattern with high resolution and high adhesion strength of fine lines can be obtd. SOLUTION: This compsn. contains (A) base polymer having 95 to 200 mgKOH/g in acid value, 50 to 120 deg.C in Tg, 10,100 to 200,000 weight average mol.wt., (B) dipentaerythritol polyalkoxylate penta and/or hexa (meth)acrylate, (C) photopolymn. initiator, and optionally (D) ethylenic unsatd. compds. except for the component (B).</p> |
