| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability by improving the adhesion between a thin-film wiring board and mold part. SOLUTION: A thin-film wiring board 2 comprising a chip supporting part and a board protruding part 2c protruding around it, a mold body part 6a formed by resin-sealing a semiconductor chip, a mold protruding part 6b protruding above a corner part 6d of a mold body part 6a, a mold reinforcing part 6c provided at a board corner part 2h on the backside of the thin-film wiring board 2, and a plurality of solder balls 3 provided on the backside of the board protruding part 2c and the chip supporting part, are provided. The mold body part 6a, the mold protruding part 6b, and the mold reinforcing part 6a are formed as one body by transfer-mold, so the adhesion between the thin-film wiring board 2 and a mold part 6 is improved.</p> |
