发明名称 Verfahren zum Versilbern von Metallkörpern
摘要 <p>A surface of copper metal or alloy e.g. brass, such as the surface of a housing component for a semi-conductor device (see Division H1), is silver-plated by subjecting it to a lapping operation during the latter part of which the lapping mass used, preferably corundum with an auxiliary lapping agent such as glycerine which may be diluted with water, contains a silvering solution such as AgCl dissolved in KCN solution.</p>
申请公布号 CH432174(A) 申请公布日期 1967.03.15
申请号 CH19630011528 申请日期 1963.09.18
申请人 SIEMENS-SCHUCKERTWERKE AKTIENGESELLSCHAFT 发明人 DR. EMEIS,REIMER,DIPL.-PHYS.
分类号 C23C18/42;H01L21/288;H01L21/48;(IPC1-7):C23C3/00;H01L7/00 主分类号 C23C18/42
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