发明名称 |
Verfahren zum Versilbern von Metallkörpern |
摘要 |
<p>A surface of copper metal or alloy e.g. brass, such as the surface of a housing component for a semi-conductor device (see Division H1), is silver-plated by subjecting it to a lapping operation during the latter part of which the lapping mass used, preferably corundum with an auxiliary lapping agent such as glycerine which may be diluted with water, contains a silvering solution such as AgCl dissolved in KCN solution.</p> |
申请公布号 |
CH432174(A) |
申请公布日期 |
1967.03.15 |
申请号 |
CH19630011528 |
申请日期 |
1963.09.18 |
申请人 |
SIEMENS-SCHUCKERTWERKE AKTIENGESELLSCHAFT |
发明人 |
DR. EMEIS,REIMER,DIPL.-PHYS. |
分类号 |
C23C18/42;H01L21/288;H01L21/48;(IPC1-7):C23C3/00;H01L7/00 |
主分类号 |
C23C18/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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