发明名称 |
Casing for integrated circuit chips and method of fabrication |
摘要 |
A method for fabricating a lead frame that includes a platform attached thereto for mounting a chip. A base frame is provided for mounting chips of various sizes. The base frame includes connection leads extending toward a central portion, which is substantially of the size of the smallest chip to mount. Connection leads are cut-out about the central portion to form an opening corresponding to the size of the chip to be mounted. A platform is soldered to at least two support leads to form the lead frame.
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申请公布号 |
US6049971(A) |
申请公布日期 |
2000.04.18 |
申请号 |
US19970876016 |
申请日期 |
1997.06.13 |
申请人 |
SGS-THOMSON MICROELECTRONICS S.A. |
发明人 |
PETIT, LUC |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01R43/00 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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