发明名称 PROCESS FOR MANAGING ETCHANT FOR EPOXY RESIN CURED MATERIAL AND PROCESS FOR ETCHING EPOXY RESIN CURED MATERIAL USING THIS MANAGEMENT PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a process for managing an etchant for epoxy cured materials, which gives a long liquid-life, a high safety and a high efficiency, and a process for etching epoxy cured materials using this management process. SOLUTION: In a management process for etchants, an etchant for epoxy resin cured materials, comprising an alkali metal compound, an amide solvent and an alcohol solvent, is stored in a gas atmosphere free of water and carbon dioxide. In an etching process, an epoxy resin cured material containing a halogen atom is subjected to an etching process using an etchant for epoxy resin cured materials, which comprises an alkali metal compound, an amide solvent and an alcohol solvent and is stored, in a gas atmosphere free of water and carbon dioxide.
申请公布号 JP2000109827(A) 申请公布日期 2000.04.18
申请号 JP19980283189 申请日期 1998.10.06
申请人 HITACHI CHEM CO LTD 发明人 MADARAME TAKESHI;OGAWA NOBUYUKI;SHIBATA KATSUJI;MATSUO AYAKO
分类号 H05K3/00;C08J7/00;C08L63/00;C09K13/06;(IPC1-7):C09K13/06 主分类号 H05K3/00
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