| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high performance silicone grease composition for heat dissipation having high heat conductivity and free from scratching the silicone surface, and to provide a semiconductor device excellent in heat dissipation efficiency using the composition. SOLUTION: This silicone grease composition is prepared by blending (A) 50-95 wt.% aluminum nitride powder having 0.5-10μm average particle diameter and containing no particles having >=100μm particle diameter, (B) 5-50 wt.% liquid silicone having viscosity of 50-500,000 cs at 25 deg.C and (C) 0-30 wt.% powder of at least one kind selected from zinc oxide, alumina, boron nitride and silicone carbide.</p> |
