| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject insulating membrane that has excellent heat resistance, moisture absorption and electric properties and is useful as an insulating membrane for semiconductor multilayer interconnections by using a specific fluorine-containing polybenzoxazole resin. SOLUTION: This insulating membrane includes a fluorine-containing polybenzoxazole resin of the formula ((m) is 10-500). The resin of the formula is prepared by polycondensation reaction between a dicarboxylic acid component, such as 4,4'-hexafluoroisopropylidene-diphenyl-1,1,-carboxylic acid, and a diamine component, such as 2,2-bis(3-amino-4-hydroxyphenyl)-hexafluoropropaene, preferably in the presence of an acid anhydride mixture of phosphorus pentoxide and methanesulfonic acid, preferably at 100-200 deg.C for 1-24 hours. This insulating membrane is obtained by dissolving the resin of the formula in a solvent, preferably preparing a varnish of 5-25 wt.% concentration, and coating the varnish with a rotary coater equipped a spinner and drying the coated layer.
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