Interleaving a bondwire between two bondwires coupled to a same terminal

摘要

An integrated circuit device package. A substrate includes a first terminal coupled to the substrate. First and second conductive traces are formed on the substrate and are electrically coupled to the first terminal wherein the first conductive trace is provided to electrically couple a first bondwire to the first terminal and the second conductive trace is provided to electrically couple the second bondwire to the first terminal.