发明名称 HEAT INSULATING STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide both flexibility and gas-blast circuit breaking performance at a low temperature by inserting/executing a low temperature heat insulating convection preventive material in the joint part and the filling part by compressively deforming the low temperature heat insulating convection preventive material. SOLUTION: A low temperature heat insulating convection preventive material 4 composed of a lightweight organic foaming body is inserted/executed in the joint part and the filling part. Since the lightweight organic foaming body has both flexibility and convection preventive performance, the low temperature heat insulating convection preventive material 4 is compressively deformed to be inserted/executed in the joint part and the filling part. In that case, to cope with the expansion of a joint width by a temperature change in a heat insulating structure, the low temperature heat insulating convection preventive material 4 is executed by compressive deformation by anticipating an expansive displacement quantity of the joint width. Thus, the lightweight organic foaming body absorbing the expansive displacement quantity of the joint width and having gas-blast circuit breaking performance is used as the low temperature heat insulating convection preventive material 4 to release strain stress by a temperature change in the heat insulating structure as well as to simultaneously provide excellent heat insulating performance.</p>
申请公布号 JP2000110988(A) 申请公布日期 2000.04.18
申请号 JP19980294619 申请日期 1998.10.01
申请人 NICHIAS CORP 发明人 KIKUCHI SHIRO;OCHIAI TAKESHI;NISHINO KENJI
分类号 B32B5/18;F16L59/02;(IPC1-7):F16L59/02 主分类号 B32B5/18
代理机构 代理人
主权项
地址