发明名称 Method and apparatus for cooling an electronic device
摘要 A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various materials such as metals or plastics.
申请公布号 US6050326(A) 申请公布日期 2000.04.18
申请号 US19980076270 申请日期 1998.05.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 EVANS, RICHARD J.;GARDELL, DAVID L.;PALAGONIA, ANTHONY M.
分类号 F28D19/04;H01L23/36;(IPC1-7):F28F5/00;H05K7/20 主分类号 F28D19/04
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