发明名称 |
Method and apparatus for cooling an electronic device |
摘要 |
A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various materials such as metals or plastics.
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申请公布号 |
US6050326(A) |
申请公布日期 |
2000.04.18 |
申请号 |
US19980076270 |
申请日期 |
1998.05.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EVANS, RICHARD J.;GARDELL, DAVID L.;PALAGONIA, ANTHONY M. |
分类号 |
F28D19/04;H01L23/36;(IPC1-7):F28F5/00;H05K7/20 |
主分类号 |
F28D19/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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