| 摘要 |
<p>PURPOSE: A shell case semiconductor package and its manufacturing method are provided to enable a deposition of a number of devices by forming leads on the glass which is adhered on both sides of a semiconductor chip having an extended pad, and connecting the leads and the pads extended, and therefore allow a high-density mounting. CONSTITUTION: A semiconductor chip(11) is formed having pads(11a) extended and a pattern formed thereon. On top and bottom surfaces of the semiconductor substrate, there are adhesive tapes(12,12') adhered. By the adhesive tapes(12,12'), first and second glasses are adhered. Leads (15,15') are formed on the surface of first and second glasses. Solder balls(16,16') are formed on the leads and the shell case semiconductor package(P) is reflown on the PCB substrate. The shell case semiconductor packages(P) having the solder balls(16,16') are deposited, reflown and thus electrically connecting the leads(15,15') formed on the first and second glasses respectively.</p> |
