SINGULATION METHOD OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE MANUFACTURING BY USING FLEXIBLE CIRCUIT BOARD STRIP

摘要

PURPOSE: A method of singulating a BGA(ball grid array) semiconductor package is to remove variation and damage at a circuit line in a flexible circuit board, thereby minimizing a short-circuit. CONSTITUTION: A metal carrier frame(80) is surface-treated to provide a smooth separation. The metal carrier frame is formed with a through hole(81) and a pin hole(82). The through hole and the pin hole are formed to correspond to a circuit pattern portion(32) and a pin hole(312). A guide hole(83) is formed on the metal carrier frame to aid its positioning. A pin hole(94) is formed on an upper plate(91) and a lower plate(92). A pin(93) is inserted sequentially to the pin holes for fixing and pressing. A copper circuit line is formed on a flexible resin film(31). The copper circuit line is extended from the circuit pattern portion. Under the flexible resin film, a solder ball is positioned.