发明名称 METHOD FOR FABRICATING A CAPACITOR OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for fabricating a capacitor of semiconductor device is provided to be able to increase the electrostatic capacitance of the capacitor by increasing the charging area of the capacitor. CONSTITUTION: The method includes the steps of forming insulating layers(12,12') on an integrated circuit substrate(10), and forming a conductive layer on the insulating layers opposite the integrated circuit substrate(10). A patterned ozone TEOS(tetraethylorthosilicate) undoped silicate layer is formed on the conductive layer, and conductive spacers(16a) are formed along sidewalls of the ozone TEOS undoped silicate layer. A dielectric layer is formed on the conductive spacers and on the first conductive layer, and a second conductive layer is formed on the dielectric layer opposite the first conductive layer and the conductive spacers.
申请公布号 KR100252211(B1) 申请公布日期 2000.04.15
申请号 KR19970004671 申请日期 1997.02.17
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 KANG, SUNG-HOON;KO, YONG-RAK;LEE, JUNG-KYU
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/04
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