发明名称 |
METHOD FOR FABRICATING A CAPACITOR OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for fabricating a capacitor of semiconductor device is provided to be able to increase the electrostatic capacitance of the capacitor by increasing the charging area of the capacitor. CONSTITUTION: The method includes the steps of forming insulating layers(12,12') on an integrated circuit substrate(10), and forming a conductive layer on the insulating layers opposite the integrated circuit substrate(10). A patterned ozone TEOS(tetraethylorthosilicate) undoped silicate layer is formed on the conductive layer, and conductive spacers(16a) are formed along sidewalls of the ozone TEOS undoped silicate layer. A dielectric layer is formed on the conductive spacers and on the first conductive layer, and a second conductive layer is formed on the dielectric layer opposite the first conductive layer and the conductive spacers.
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申请公布号 |
KR100252211(B1) |
申请公布日期 |
2000.04.15 |
申请号 |
KR19970004671 |
申请日期 |
1997.02.17 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
KANG, SUNG-HOON;KO, YONG-RAK;LEE, JUNG-KYU |
分类号 |
H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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