发明名称 |
STRUCTURE AND METHOD OF TRENCH ISOLATION HAVING NITRIDE LINER OF THIN FILM PROTECTED WITH SPACER |
摘要 |
PURPOSE: A method for isolating a trench having nitride liner of thin film protected with spacer is provided to prevent the generation of a dent on an interface(D) between an active region of a semiconductor substrate and a field region where an isolation is formed. CONSTITUTION: A silicon nitride liner(135a) is prevented to be over-etched in a post etching process by forming an insulation spacer on the silicon nitride liner on a trench side wall(127) adopted to prevent the defect generated in a trench isolation. The nitride liner is separated from a silicon nitride pattern which is used as an etching mask and is stacked on top of a semiconductor substrate(110) of an active region by transforming the nitride liner for suppressing the generation of stress on the semiconductor substrate into a spacer form.
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申请公布号 |
KR20000020911(A) |
申请公布日期 |
2000.04.15 |
申请号 |
KR19980039726 |
申请日期 |
1998.09.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, HAN SIN |
分类号 |
H01L21/76;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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