| 摘要 |
PURPOSE: An etching device for manufacturing semiconductor device using ozone water,which cools the upper part of an ozon water to maintain a high density of the ozon water, is provided to enhance productivity by uniformly and stably performing the etching process through the circulation of the lower part of the ozone water. CONSTITUTION: An etching device for manufacturing semiconductor device using ozone water comprises an inner tank(1), an outer tank(2) formed on the outer circumferential of the inner tank, a circulating pipe(3) connecting the inner and outer tanks, a first cooling coil(11) attached to the top of the inner tank, and a second cooling coil(12) attached to the top of the outer tank. Plural through holes(13) are formed in the bottom wall of the first cooling coil.
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