| 摘要 |
<p>A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by patternwise delivery of heat, comprises a polymer of general formula (I), wherein R1 represents a hydrogen atom or alkyl group, R2 represents a hydrogen atom or alkyl group, R3 represents a hydrogen atom or alkyl group, and R4 represents an alkyl or hydroxyalkyl group, and wherein the ratio n/m is in the range 10/1 to 1/10.</p> |
